University of California Research Silicon Board: Increased Processor Speed

On January 12th, the well-known researcher Cen Yingxi described many novel ideas in science and technology, such as "Cold thinking, revitalizing computing science and technology", such as cold quantum neurons, calculating with wires, attacking nano droplets, silicon circuit boards, etc. .

Nicknamed, computer designers are all exploring why the movement of data within the chip is so easy, and the movement between chips is much slower and more laborious. According to engineers at the University of California, Los Angeles (UCLA), it is due to problems with chip packaging and printed circuit boards. None of them are good thermal conductors, which limits the amount of energy allowed to dissipate. They also increase the amount of energy and time required to move digitally between chips. For this reason, the industry has seen these problems, and began to package multiple chips together.

Puneet Gupta and his UCLA colleagues recommend replacing a traditional printed circuit board with a small silicon circuit board. On such a "silicon chip", unpackaged bare chips can be constricted within 100 microns and connected by the same wiring as integrated circuits, reducing latency, power consumption, and system size.

This approach helps to break the expensive system-on-chip (SOC) and replace it with cheap chiplets, allowing the chipset to perform various core functions on the SOC. In addition, because silicon conducts heat better than printed circuit boards, you can run processor cores at higher speeds.


Acryl Curing Agent

Acrylic curing agents are a type of crosslinking agent used in the production of high-performance coatings and adhesives. Acrylic curing agents are typically used to cure Epoxy Resins, improving their mechanical properties, chemical resistance, and thermal stability.


Acrylic curing agents react with the epoxy functional group to form a thermosetting coating or adhesive. This reaction is exothermic and can be accelerated by heat, making it ideal for high-temperature applications. Once cured, the acrylic modified epoxy resin offers excellent resistance to weathering, UV light, and chemicals.


Acrylic curing agents offer several advantages over other types of curing agents. They are low in viscosity, which makes them easy to handle and mix with epoxy resins. They also have excellent adhesion to a wide range of substrates, including metals, plastics, and composites.


Acrylic curing agents are available in a range of grades, each with its own unique properties and applications. Some grades offer improved toughness and flexibility, while others offer improved chemical resistance or high-temperature performance. The choice of acrylic Curing Agent depends on the specific application requirements, such as cure time, cure temperature, and final properties of the cured epoxy resin.


Acrylic curing agents are commonly used in applications where high-performance coatings or adhesives are required, such as automotive, aerospace, and marine applications. They are also used in the production of electrical and electronic components, where their excellent electrical properties make them an ideal choice.


In summary, acrylic curing agents are a type of crosslinking agent used to cure epoxy resins in the production of high-performance coatings and adhesives. They offer several advantages over other types of curing agents, including low viscosity and excellent adhesion to a wide range of substrates. The choice of acrylic curing agent depends on the specific application requirements, and they are commonly used in applications that require high-performance coatings or adhesives, such as automotive, aerospace, and marine applications.

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